Japan, Feb. 12 -- TOKIN CORP has got intellectual property rights for 'PRESSURE-SENSITIVE ADHESIVE TAPE AND TAPE ROLL.' Other related details are as follows: Application Number: JP,2022-038825 Categ... Read More
Japan, Feb. 12 -- SHIN ETSU CHEM CO LTD has got intellectual property rights for 'CHEMICALLY AMPLIFIED RESIST MATERIAL AND PATTERN FORMING METHOD.' Other related details are as follows: Application N... Read More
Japan, Feb. 12 -- DENSO CORP has got intellectual property rights for 'VEHICLE ENVIRONMENT IMPROVEMENT SYSTEM.' Other related details are as follows: Application Number: JP,2022-038367 Category (FI)... Read More
Japan, Feb. 12 -- NOF CORP has got intellectual property rights for 'SURFACE MODIFIER COMPOSITION FOR ELASTOMER AND ELASTOMER COMPOSITION INCLUDING THE SAME.' Other related details are as follows: Ap... Read More
Japan, Feb. 12 -- FUJITSU LTD has got intellectual property rights for 'METHOD OF PRODUCING ATOMIC FILM, AND ATOMIC FILM.' Other related details are as follows: Application Number: JP,2022-038127 Ca... Read More
Japan, Feb. 12 -- RICOH INDUSTRIAL SOLUTIONS INC has got intellectual property rights for 'DISTANCE MEASURING APPARATUS AND MOVABLE BODY.' Other related details are as follows: Application Number: JP... Read More
Japan, Feb. 12 -- FUJIFILM BUSINESS INNOVATION CORP has got intellectual property rights for 'INTERMEDIATE TRANSFER BELT, TRANSFER DEVICE, AND IMAGE FORMING APPARATUS.' Other related details are as fo... Read More
Japan, Feb. 12 -- SUMITOMO ELECTRIC IND LTD has got intellectual property rights for 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE.' Other related details are as follows: Ap... Read More
Japan, Feb. 12 -- FUJITA CORP has got intellectual property rights for 'ADSORBENT.' Other related details are as follows: Application Number: JP,2022-037102 Category (FI): B01J20/28@Z,B01J20/20@E,B0... Read More
Japan, Feb. 12 -- SEIKO EPSON CORP has got intellectual property rights for 'MANUFACTURING METHOD OF INK REFILL CONTAINER.' Other related details are as follows: Application Number: JP,2022-036896 C... Read More